2021 3rd International Conference on Electronic Engineering and Informatics
Call for paper
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The conference is soliciting state-of-the-art research   papers in the following areas of interest but not limited to:

Topic 1: Electronic Technology

  • 3D process and integration technology

  • Substrate embedding and advanced flip chip packaging

  • MEMS and sensor technology

  • Wafer-level CSP and heterogeneous integration

  • Design and Analysis of Transmission System

  • New materials, equipment and 3D interconnection

  • Wearable, flexible and stretchable electronics

  • Optical interconnection and 3D photonics

  • Digital system and logic design

  • Computer architecture and VLSI

  • Network-driven multi-core chip

  • Advanced robotic system

  • Motor

  • Analog and digital electronics

  • Signals and Systems


Topic 2: Information and Communication

  • Electronic equipment

  • Satellite and Space Communications

  • Network and Information Security

  • Signal processing for wireless communication

  • Cognitive Radio and Software Radio

  • Optical networks and systems

  • Electromagnetic field theory

  • Antenna, propagation and transmission technology

  • Optical communication

  • Radar signal and data processing


专题1:电子技术

  • 3D流程和集成技术

  • 基板嵌入和先进的倒装芯片封装

  • MEMS和传感器技术

  • 晶圆级CSP和异构集成

  • 输电系统的设计与分析

  • 新型材料,设备和3D互连

  • 可穿戴,灵活和可伸展的电子产品

  • 光学互连和3D光子学

  • 数字系统与逻辑设计

  • 计算机体系结构和VLSI

  • 网络驱动的多核芯片

  • 先进的机器人系统

  • 电机

  • 模拟和数字电子

  • 信号与系统


专题2:信息和通信

  • 电子设备

  • 卫星与太空通讯

  • 网络与信息安全

  • 无线通信的信号处理

  • 认知无线电和软件无线电

  • 光网络和系统

  • 电磁场理论

  • 天线,传播和传输技术

  • 光通讯

  • 雷达信号与数据处理